The QSiC Dual3 family of 1,200-V half-bridge MOSFET modules developed by SemiQ Inc. targets motor drives in data center cooling systems, grid converters in energy storage systems, and industrial ...
Rohm has introduced the DOT-247, a 2-in-1 SiC molded module that combines two TO-247 devices to deliver higher power density. The dual structure accommodates larger chips, while the optimized internal ...
The third-generation series of QSiC MOSFET modules from SemiQ Inc. offer current capabilities of up to 608 A and a junction-to-case thermal resistance of just 0.07ºC/W to address the growing demand ...
SemiQ continues to expand its Gen3 QSiC MOSFET portfolio with 1200-V power modules offering high current density and low thermal resistance. The new seven-device lineup includes high-current S3 ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
Microchip Technology has announced the availability of its new 3.3 kV HV-D3 mSiC power modules, aimed at simplifying the adoption of solid-state transformers (SSTs) in artificial intelligence (AI) ...
Rather than treating wireless road charging as a futuristic curiosity, Infineon and Electreon are now framing it as infrastructure that can rival the power levels of today’s top DC fast chargers. By ...
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