Applied Materials unveils more advanced chipmaking gear for 3D stacking architectures

Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so ...
Electronic Design

Samsung Develops Efficient DRAM Stacking Process

Deemed the first all-DRAM stacked memory package using through silicon via (TSV) technology, the company's wafer-level-processed stacked package (WSP) consists of four 512-Mb DDR2 DRAM chips that ...
JEC Composites

Schmidt & Heinzmann’s cutting and stacking solution awarded

The cutting & stacking center of Schmidt & Heinzmann cuts and stacks cuts from dry fiber fabric and precisely stacks them into a stack. Thanks to an optimal coordination of hardware and software, it ...
DATAQUEST

Applied Materials intros new systems to accelerate 3D architectures powering AI chips

There are new CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip ...
The Manila Times

Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM fabs adds a critical logic-class step-boosting memory ...
TweakTown

Huawei to use HBM in smartphones with 3D stacking tech: will boost efficiency, AI performance

Use left and right arrow keys to seek audio. Chinese tech giant Huawei is expected to beat Apple to incorporating HBM DRAM inside of its smartphones, with 3D stacking technology to improve efficiency ...